A block diagram is extracted according to the requirements and a circuit schematic is prepared. Component selection is made, and critical lines and protection structures are determined.
The layer structure, dimensions, and mounting holes are planned according to the design. Placement is carried out following trace width, power distribution, and signal integrity rules.
Input supply, regulator selection, and protection elements (fuse, TVS, reverse polarity) are designed. Power paths are optimized for efficiency and heat management.
Interfaces such as UART, I2C, SPI, CAN, or Ethernet are selected based on the requirements and integrated into the schematic. Details like ESD/EMI precautions and line impedance are considered.
Gerber, BOM, and assembly files are prepared and made suitable for production. The prototype board is printed, component assembly is performed, and initial checks are conducted.
Function tests, stress tests, and long-term operating tests are applied. Revisions are made based on measurement results, and the final version is stabilized.